Push-Fit Test Board for 25 x 25mm Substrates conductive-additive is one of the most

is one of the most studied and suitable hole transport layer materials (HTL) due to its facile implementation and high performance in organic-inorganic electronic devices

152106 (2017)

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Electron doping induced semiconductor to metal transitions in ZrSe2 layers via copper atomic intercalation

Push-Fit Test Board for 25 x 25mm Substrates conductive-additive is one of the mostFast and secure electrical connections. Make PV and OLED device testing easy. The Push Fit Test Board for 25mm Square Substrates is part of Ossila's award winning prototyping platform for photovoltaic devices. The connection pins on the circuit board align with the contacts on our glass ITO substrates. This makes connecting to devices quick and easy. Quickly switch between the pixels of a completed device, and electrically test via the BNC connection.